Semiconductors: the challenge of precision in coating and deposition technologies

On 25 February, the session “Coating and deposition technologies for Semiconductor Manufacturing" by Ernesto Barrera, General Manager of PhotonExport, gathered more than 30 participants, as part of the Semiconductors & Technology lecture series promoted by the Department of Physics at the University of Aveiro.

The presentation focused on the role of thin films in microelectronics. These extremely controlled layers of materials are deposited onto substrates such as silicon wafers and are essential for the construction of semiconductor devices. The precision of these deposition processes is crucial for the electrical performance, reliability, and chip miniaturisation.

Several deposition technologies used in semiconductor manufacturing were presented during the session. Among them, Atomic Layer Deposition (ALD) stood out, a process that allows atomic-scale control of film thickness and high conformality, particularly relevant for increasingly complex structures. Technologies such as Physical Vapor Deposition (PVD) and Chemical Vapor Deposition (CVD), widely used in the deposition of metals, oxides, and nitrides at different stages of the manufacturing process, were also discussed.

The session also addressed the industrial requirements associated with semiconductor manufacturing, including highly controlled cleanroom environments, demanding production processes, and significant investments in specialised equipment.

The initiative highlighted the relevance of thin film deposition technologies in the development of semiconductor devices, emphasising the role of these processes in the evolution of microelectronics and in meeting the growing global demand for chips, driven by areas such as artificial intelligence and digital transformation.

 

Photos: INOVA Ria